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Method and Design of High-Performance Interconnects with Improved Signal Integrity
Reference #: 01444
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Background:
Over the last few decades, there has been a progressively expanded tendency of increasing trace density on printed circuit boards (PCBs) and silicon dies in the...
Published: 7/16/2026
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Updated: 5/14/2021
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Inventor(s): Guoan Wang, Jinqun Ge
Keywords(s): capacitive coupling, dielectric material, Far-end crosstalk (FEXT), interconnect, interdigital trapezoidal tabs, magnetic coupling, magnetic material
Category(s): Engineering and Physical Sciences
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